Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications

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Spice Based Heat Transport Model for Non-Intrusive Thermal Diagnostic Applications
 

Authored by Michael A. Stelzer

This research text provides a detailed look at the equivalence between the thermal system of equations and the variables of circuit theory. This relationship is used together with SPICE (Simulation Program with Integrated Circuits Emphasis), to accurately model heat flow with traditional methods in electrical engineering. The book details the computational complexity of heat flow and why an electrical analogue to the thermal system improves the efficiency and computational speed of the solutions.


Publication Date:
2005-08-17
ISBN/EAN13:
1419606131 / 9781419606137
LCCN:
2005902826
Page Count:
160
Binding Type:
US Trade Paper
Trim Size:
7" x 10"
Language:
English
Color:
Black and White
Related Categories:
Education / Computers & Technology




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